tem micrograph中文什么意思

micrograph: n. 微寫器；【物理學(xué)】微動擴(kuò)大測定器；顯微(鏡)制圖[ ...
micrograph: n. 微寫器；【物理學(xué)】微動擴(kuò)大測定器；顯微(鏡)制圖[照相、照片]。
tem: 登; 電磁測深; 控制系統(tǒng)的提起訴訟的限期; 滅火; 目標(biāo)接戰(zhàn)信文; 三亞安三嗪; 三亞胺嗪,三乙撐亞胺均三嗪,三乙撐蜜胺; 三乙撐三聚氰酰胺; 三乙烯亞胺三嗪, 替姆, 癌寧; 瞬變電磁法; 泰米; 泰姆; 透過電子顯微鏡; 透射電鏡; 透射電子顯微鏡; 透射電子顯微術(shù); 英語四八級考試; 英語四級八級; 英語專業(yè)等級考試
electro micrograph: 電子顯微鏡相片
electron micrograph: 電鏡照片; 電子微動描記器; 電子微寫器; 電子顯微鏡檢查，電子顯微照片; 電子顯微鏡相片; 電子顯微鏡照片; 電子顯微鏡照相; 電子顯微圖; 電子顯微照相

下載手機(jī)詞典可隨時隨地查詞查翻譯

2 structure measurement of multi - wall carbon nanotubes after ball milling . the long cnts has been shorted by commen ball milling and effect of time on cnts has researched . the mechanism of cut has been analyzed . 3 the research of adsorption of mnoa by cnts , the tem micrograph of cnts and mechanism were analyzed
2多壁碳納米管球磨后的結(jié)構(gòu)表征，采用低速球磨機(jī)，使碳納米管變短，澎器掀蕊研究了球磨時間對碳納米管的影響，對其斷裂機(jī)制作了定性分析。
For xrd , ellipsometry examinations , single - side - polished si ( lll ) wafers were used as substrates and for resistance measurement , glass was used and for infrared examination , double - side - polished si ( lll ) wafers were used and for ultraviolet - visible spectrophotometry , double - side - polished quartz wafers were used and for tem micrograph and electron diffraction pattern observation , cu nets deposited by formvar film were used . the cu - mgf2 cermet films were from 50 to 600nm thick
用于xrd分析、橢偏測量的單拋si ( 111 )晶片和電阻測試的載玻片上淀積膜厚約為600nm ；用于ir測試的雙拋si ( 111 )晶片和uv測試的石英玻璃片上淀積膜厚約為250nm ；用于透射電鏡分析的樣品則淀積在400目銅網(wǎng)上的支撐formvar膜上，膜厚約為50 100nm 。

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